Capacitance touch panel module and fabrication method thereof

ABSTRACT

A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.

CROSS REFERENCE TO RELATED PATENT APPLICATION

This application is a continuation application of and claims prioritybenefit of U.S. application Ser. No. 14/246,788, filed on Apr. 7, 2014,which claims the priority benefit of U.S. application Ser. No.12/718,068, filed on Mar. 5, 2010, patented on May 20, 2014, with U.S.Pat. No. 8,729,910, which claims the benefit of Chinese applicationSerial No. 200910307440.0, filed on Sep. 22, 2009. The entirety of theabove-mentioned patent application is incorporated herein by referenceand made a part of this specification.

BACKGROUND

1. Technical Field

The present disclosure generally relates to capacitance touch panelmodules, and particularly, to a capacitance touch panel module and afabrication method thereof.

2. Description of Related Art

Capacitance touch panels are often used in portable electronic devicesdue to their dustproof, multi-touch capabilities, and thermostableproperties.

A commonly used capacitance touch panel module includes a touch paneland a cover lens bonded thereto by using optical adhesive. The touchpanel includes a base plate, two transparent conductive layers, and twoinsulating layers. The conventional touch panel module having fivelayers, in combination with a possibly-added cover lens, results in anoverly thick unit having lesser than optimum light transmittance, andreduced quality. In addition, the optical adhesive is expensive andcannot be recycled.

Therefore, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the drawings are not necessarily drawn to scale, theemphasis instead being placed upon clearly illustrating the principlesof the present disclosure. Moreover, in the drawings, like referencenumerals designate corresponding parts throughout several views, and allthe views are schematic.

FIGS. 1 through 5 show a first embodiment of a method of fabricating acapacitance touch panel module.

FIGS. 6 through 9 show a second embodiment of a method of fabricating acapacitance touch panel module.

DETAILED DESCRIPTION

Referring to FIGS. 1 and 2, a first embodiment of a method offabricating a capacitance touch panel module is described as follows. Asubstrate 301 with a touching area 302 and a peripheral area 304arranged around the touching area 302 is provided. The substrate 301 maybe made of glass, quartz, plastic, resin, acrylic fabric, or othertransparent material.

A transparent conductive layer (not shown) is formed on the substrate301 of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zincoxide (AZO), gallium zinc oxide (GZO), magnesium indium oxide (MIO), orother transparent conductive materials. The transparent conductive layeris etched to form a plurality of first conductive patterns 303, aplurality of second conductive patterns 307, and a plurality ofconnecting portions 305 in the touching area 302. The first conductivepatterns 303 are arranged in a plurality of rows along a firstorientation 309. The second conductive patterns 307 are arranged betweenthe neighboring rows of the first conductive patterns 303. Eachconnecting portion 305 connects two neighboring first conductivepatterns 303 which are arranged in a row. The first conductive patterns303 are electrically insulated from the second conductive patterns 307.

Referring to FIG. 3, a photoresist layer (not shown) or similar types ofphotosensitive insulating layer is formed on the substrate 301 andundergoes lithography to form a plurality of insulated protrusions 313in the touching area 302 and forms an insulated frame 306 covering theperipheral area 304. Each insulated protrusion 313 covers one connectingportion 305 and at least part of the first conductive pattern 303connecting with the connecting portion 305. The insulated protrusions313 and the insulated frame 306 may be made of light absorption materialto obtain a shading effect.

The insulated protrusions 313 and the insulated frame 306 may also bephoto etched. In detail, an insulated layer may be formed on thesubstrate 301, followed by a photoresist layer formed on the insulatedlayer, and the photoresist layer may be formed by lithography, afterwhich the insulated layer may be etched through the developedphotoresist layer to form the insulated protrusions 313 and theinsulated frame 306. Alternatively, the insulated protrusions 313 andthe insulated frame 306 may be formed by ink jet printing.

The method may also include baking for about one hour at 200° C. to 300°C., preferably at 220° C. The surface of each insulated protrusion 313becomes curved after baking due to cohesion of the insulated protrusions313.

Referring to FIG. 4, a metallic layer (not shown) is deposited on thesubstrate 301, with a plurality of bridging members 327 formed in thetouching area 302 and a plurality of conductive wires 308 formed in theinsulated frame 306. Each bridging member 327 covers one insulatedprotrusion 313 and electrically connects two neighboring secondconductive patterns 307 along a second orientation 311. Parts of theconductive wires 308 connect with parts of the first conductive patterns303, respectively. The other parts of the conductive wires 308 connectwith parts of the second conductive patterns 307.

Referring to FIG. 5, a protective layer 310 is formed on the substrate301 covering the entire touching area 302 and the entire peripheral area304 to protect the contact structure (not labeled) and the conductivewires 308. The contact structure includes the first conductive patterns303, the second conductive patterns 307, the bridging members 327, theinsulated protrusions 313, and the connecting portions 305. Theprotective layer 310 may be silicon oxide, silicon nitride, or othermaterials.

Referring to FIGS. 1 through 5, the first embodiment of the method offabricating a capacitance touch panel module is described in thefollowing: in step S101, a substrate 301 comprising a touching area 302and a peripheral area 304 around the touching area 302 is provided; instep S103, a plurality of first conductive patterns 303, a plurality ofsecond conductive patterns 307, and a plurality of connecting portions305 is formed, in which the first conductive patterns 303 are arrangedin a plurality of rows along a first orientation 309, the secondconductive patterns 307 are arranged between neighboring rows of thefirst conductive patterns 303, wherein each connecting portion 305connects two neighboring first conductive patterns 303 arranged in arow, and the first conductive patterns 303 are electrically insulatedfrom the second conductive patterns 307; in step S105, a plurality ofinsulated protrusions 313 in the touching area 302 and an insulatedframe 306 in the peripheral area 304 are formed, wherein each insulatedprotrusion 313 covers one connecting portion 305; in step S107, abridging member 327 is formed on each insulated protrusion 313, and thebridging member 327 electrically connects two neighboring secondconductive patterns 307.

Referring to FIGS. 6 and 7, a second embodiment of a method offabricating a capacitance touch panel module is described as follows. Asubstrate 401 with a touching area 402 and a peripheral area 404arranged around the touching area 402 is provided. A plurality ofbridging members 427 is formed in the touching area 402.

Referring to FIG. 8, a plurality of insulated protrusions 413 is formedin the touching area 402. Each insulated protrusion 413 covers at leastpart of one bridging member 427. An insulated frame 406 is formed in theperipheral area 404. The insulated protrusions 413 and the insulatedframe 406 are formed as disclosed in the first embodiment.

Referring to FIG. 9, a transparent conductive layer (not shown) isformed on the substrate 401, for supporting a plurality of firstconductive patterns 403, a plurality of second conductive patterns 407,and a plurality of connecting portions 405 in the touching area 402. Thearrangement of the first conductive patterns 403, the second conductivepatterns 407, and the connecting portions 405 is substantially the sameas that of the first conductive patterns 303, the second conductivepatterns 307, and the connecting portions 305 of the first embodiment.Each bridging member 427 connects two second conductive patterns 407,and each connecting portion 405 covers parts of one insulated protrusion413.

A plurality of conductive wires 408 is formed on the insulated frame406. Parts of the conductive wires 408 connect with parts of the firstconductive patterns 403, respectively. The other parts of the conductivewires 408 connect with parts of the second conductive patterns 407,respectively. Then a protective layer (not shown) is formed on thesubstrate 401 and covers the entire touching area 402 and the entireperipheral area 404. Thus, a capacitance touch panel module 400 with ahigher transmittance is formed.

Referring to FIGS. 6 through 9, the second embodiment of the method offabricating a capacitance touch panel module is described in thefollowing: in step S601, a substrate 401 comprising a touching area 402and a peripheral area 404 around the touching area 402 is provided; instep S603, a bridging member 427 is formed in the touching area 402; instep S605, a plurality of insulated protrusions 413 in the touching area402 and an insulated frame 406 in the peripheral area 404 are formed,wherein each insulated protrusion 413 at least partially covers onebridging member 427; in step S607, a plurality of first conductivepatterns 403, a plurality of second conductive patterns 407, and aplurality of connecting portions 405 are formed, in which the firstconductive patterns 403 are arranged in a plurality of rows along afirst orientation 409, the second conductive patterns 407 are arrangedbetween neighboring rows of the first conductive patterns 403, andwherein each connecting portion 405 connects two neighboring firstconductive patterns 403 arranged in a row, each bridging member 427connects two neighboring second conductive patterns 407, and the firstconductive patterns 403 are electrically insulated from the secondconductive patterns 407.

The capacitance touch panel modules 300, 400 set the substrate 301, 401as the touching portion, such that no protective lens is needed in thecapacitance touch panel modules 300, 400, which thereby able to providehigher transmittance. The touching structures of the capacitance touchpanel modules 300, 400 are formed by lithography or photo etching, suchthat no optical adhesive is required in the fabrication method.

Finally, while various embodiments have been described and illustrated,the disclosure is not to be construed as being limited thereto. Variousmodifications can be made to the embodiments by those skilled in the artwithout departing from the true spirit and scope of the disclosure asdefined by the appended claims.

What is claimed is:
 1. A capacitance touch panel, comprising: asubstrate comprising a touching area and a peripheral area around thetouching area; a plurality of insulated protrusions in the touchingarea; an insulated frame in the peripheral area; a plurality of firstconductive patterns arranged in a plurality of rows along a firstorientation; a plurality of second conductive patterns arranged along asecond orientation and arranged between neighboring rows of the firstconductive patterns, wherein the first conductive patterns areelectrically insulated from the second conductive patterns; a pluralityof connecting portions, wherein each connecting portion connects twoneighboring ones of the first conductive patterns arranged in a row; aplurality of bridging members electrically connecting two neighboringones of the second conductive patterns; and an overlapping regioncomprising a first region and a second region, wherein the overlappingregion is an area on which one of the bridging members overlaps one ofthe second conductive patterns, the bridging member is directly on thesecond conductive pattern in the first region, and one of the insulatedprotrusions is directly on the second conductive pattern in the secondregion; wherein one of the insulated protrusions has a curved surfaceand covers one of the connecting portions; and wherein the length of thefirst region along the second orientation is longer than the length ofthe second region along the second orientation.
 2. The capacitance touchpanel of claim 1, wherein one of the insulated protrusions covers one ofthe connecting portions, and one of the bridging members crosses theinsulated protrusion.
 3. The capacitance touch panel of claim 1, whereinone of the insulated protrusions covers one of the bridging members, andone of the connecting portions crosses the insulated protrusion.
 4. Thecapacitance touch panel of claim 1 further comprising a plurality ofconductive wires on the insulated frame, connecting to the firstconductive patterns and the second conductive patterns respectively. 5.The capacitance touch panel of claim 4, wherein one of the conductivewires extends from the corresponding first conductive patterns or thecorresponding second conductive patterns to the top surface of theinsulated frame along the curved side surface.
 6. The capacitance touchpanel of claim 1, wherein the insulated protrusions and the insulatedframe are made of light absorbing materials.
 7. The capacitance touchpanel of claim 1 further comprising a protective layer covering thetouching area and the peripheral area.
 8. A method of fabricating acapacitance touch panel, comprising: providing a substrate comprising atouching area and a peripheral area around the touching area; forming aplurality of insulated protrusions in the touching area; forming aninsulated frame in the peripheral area; forming a plurality of firstconductive patterns arranged in a plurality of rows along a firstorientation; forming a plurality of second conductive patterns arrangedalong a second orientation and arranged between neighboring rows of thefirst conductive patterns, wherein the first conductive patterns areelectrically insulated from the second conductive patterns; forming aplurality of connecting portions, wherein each connecting portionconnects two neighboring ones of the first conductive patterns arrangedin a row; forming a plurality of bridging members electricallyconnecting two neighboring ones of the second conductive patterns; andforming an overlapping region comprising a first region and a secondregion, wherein the overlapping region is the area on which one of thebridging members overlaps one of the second conductive patterns, thebridging member is directly on the second conductive pattern in thefirst region, and one of the insulated protrusions is directly on thesecond conductive pattern in the second region; wherein one of theinsulated protrusions has a curved surface and covers one of theconnecting portions; and wherein the length of the first region alongthe second orientation is longer than the length of the second regionalong the second orientation.
 9. The method of fabricating a capacitancetouch panel of claim 8, wherein the insulated protrusions and theinsulated frame are made of light absorbing materials.
 10. The method offabricating a capacitance touch panel of claim 8, wherein step offorming the insulated protrusions and step of forming the insulatedframe are performed by ink jet printing.
 11. The method of fabricating acapacitance touch panel of claim 8, wherein step of forming a pluralityof bridging members further comprises forming a plurality of conductivewires on the insulated frame, connecting to the first conductivepatterns and the second conductive patterns respectively.
 12. The methodof fabricating a capacitance touch panel of claim 11, wherein one of theconductive wires extends from the corresponding first conductive patternor the corresponding second conductive patterns to the top surface ofthe insulated frame along the curved side surface.
 13. The method offabricating a capacitance touch panel of claim 8 further comprisingforming a protective layer covering the touching area and the peripheralarea.